STW81103 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'STW81103' PDF : 53 Pages View PDF
Package mechanical data
10 Package mechanical data
STW81103
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages, which have a lead-free second level interconnect. The category of second level
interconnect is marked on the package and on the inner box label, in compliance with
JEDEC standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: http://www.st.com.
Figure 40. VFQFPN28 mechanical drawing
Note: 1 VFQFPN stands for Thermally Enhanced Very thin Fine pitch Quad Flat Package No lead.
(Very thin: A=1.00 Max)
2 Details of the terminal 1 identifier are optional, but if given, must be located on the top
surface of the package by using either a mold or marked features.
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