TC1307
Note: Unless otherwise indicated, VIN = 3.8V, CIN = 10 µF ceramic (X5R), COUT = 1 µF ceramic (X5R), ILOAD = 100 µA,
SELECT12 = NC, SELECT34 = VIN, SHDN1/2/3/4 = VIN, TA = 25°C.
Junction temperature (TJ) is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the
Ambient temperature is not significant.
0.160
0.140
VOUT = 2.8V
0.120
TJ = +125°C
0.100
0.080
0.060
TJ = +25°C
TJ = -40°C
0.040
0.020
0.000
0
25
50
75
100
125
150
Load Current (mA)
FIGURE 2-13: Dropout Voltage vs. Load Current.
0.140
0.120
VOUT = 3.0V
0.100
0.080
0.060
TJ = +125°C
TJ = +25°C
TJ = +40°C
0.040
0.020
0.000
0
25
50
75
100
125
150
Load Current (mA)
FIGURE 2-14: Dropout Voltage vs. Load Current.
FIGURE 2-16: Crosstalk Characteristics VOUT1,
VOUT2, and VOUT3.
FIGURE 2-17: Crosstalk Characteristics VOUT1,
VOUT2, and VOUT3.
FIGURE 2-15: Crosstalk Characteristics VOUT1,
VOUT2 and VOUT3.
FIGURE 2-18: Crosstalk Characteristics VOUT1,
VOUT2, and VOUT3.
2002 Microchip Technology Inc.
DS21702A-page 7