Qdatasheet_Logo
Integrated circuits, Transistor, Semiconductors Search and Datasheet PDF Download Site

TC1307 View Datasheet(PDF) - Microchip Technology

Part Name
Description
MFG CO.
'TC1307' PDF : 28 Pages View PDF
1 2 3 4 5 6 7 8 9 10 Next
TC1307
Note: Unless otherwise indicated, VIN = 3.8V, CIN = 10 µF ceramic (X5R), COUT = 1 µF ceramic (X5R), ILOAD = 100 µA,
SELECT12 = NC, SELECT34 = VIN, SHDN1/2/3/4 = VIN, TA = 25°C.
Junction temperature (TJ) is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the
Ambient temperature is not significant.
FIGURE 2-19: Line Step Response.
70
60
50
40
30
20
10
0
1.0E+01
VIN = 4.1V
VOUT = 2.8V
COUT = 10µF Ceramic
ILOAD = 100 mA
1.0E+02 1.0E+03 1.0E+04 1.0E+05
Ripple Voltage Frequency (Hz)
1.0E+06
FIGURE 2-22: Power Supply Rejection Ratio vs.
Ripple Voltage Frequency.
FIGURE 2-20: Line Step Response.
70
60
50
40
30
20
10
0
1.0E+01
VIN = 4.1V
VOUT = 2.8V
COUT = 1 µF Ceramic
ILOAD = 100 mA
1.0E+02 1.0E+03 1.0E+04 1.0E+05
Ripple Voltage Frequency (Hz)
1.0E+06
FIGURE 2-21: Power Supply Rejection Ratio vs.
Ripple Voltage Frequency.
FIGURE 2-23: Output Noise.
FIGURE 2-24: Output Noise.
DS21702A-page 8
2002 Microchip Technology Inc.
Share Link: GO URL

All Rights Reserved © qdatasheet.com  [ Privacy Policy ] [ Contact Us ]