TC1401 View Datasheet(PDF) - Transcom, Inc.
Part Name
Description
MFG CO.
'TC1401' PDF : 4 Pages View PDF
SCHEMATI
Lg
Rg
Cgd
Cgs
Gm
Cds
Ri
T
Rs
Ls
Rd Ld
Rds
PARAMETERS
Lg
0.0813 nH
Rg
0.93 Ohm
Cgs
2.29 pF
Ri
1.85 Ohm
Cgd
0.08 pF
Gm
233.5 mS
T
3.9 psec
TC1401
REV5_20070502
Rs
1.06 Ohm
Ls
0.01 nH
Cds
0.298 pF
Rds
119 Ohm
Rd
1.4 Ohm
Ld
0.014 nH
SMALL SIGNAL MODEL, VDS = 8 V, IDS = 120 mA
SCHEMATI
TOM2 MODEL PARAMETERS
Lg Rg
Cgs
Ris
Cgd Rid
Id
Cds
Rs
Ls
Rd Ld
Rdb
Cbs
VTO
ALPHA
BETA
GAMMA
DELTA
Q
NG
ND
TAU
RG
RD
RS
IS
N
VBI
VDELTA
-1.8 V VMAX
4.98
CGD
0.303
CGS
0.021
CDS
0.142
RIS
0.99
RID
0.1
VBR
0.01
RDB
3.9 ps CBS
0.9308 Ohm TNOM
1.4 Ohm LS
1.092 Ohm LG
1E-11 mA LD
1
AFAC
1 V NFING
0.2 V
0.5 V
0.0743 pF
3.7075 pF
0.303 pF
1.853 Ohm
0.0001 Ohm
15 V
121.37 Ohm
4.569 pF
25 °C
0.0096 nH
0.0813 nH
0.014 nH
1
1
CHIP HANDLING
DIE ATTACHMENT: Conductive epoxy or eutectic die attach is recommended. Eutectic die attach can be
accomplished with Au-Sn (80%Au-20%Sn) perform at stage temperature: 290°C ± 5°C; Handling Tool: Tweezers;
Time: less than 1min.
WIRE BONDING: The recommended wire bond method is thermocompression bonding with 0.7 to 1.0 mil
(0.018 to 0.025 mm) gold wire. Stage temperature: 220°C to 250°C; Bond Tip Temperature: 150°C; Bond Force:
20 to 30 gms depending on size of wire and Bond Tip Temperature.
HANDLING PRECAUTIONS: The user must operate in a clean, dry environment. Care should be exercised
during handling avoid damage to the devices. Electrostatic Discharge (ESD) precautions should be observed at all
stages of storage, handling, assembly, and testing. The static discharge must be less than 300V.
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: 886-6-5050086
Fax: 886-6-5051602
4/4
Share Link: 
