TDA7491MV View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'TDA7491MV' PDF : 28 Pages View PDF
Application information
TDA7491MV
7.9
Heatsink requirements
A thermal resistance of 24 °C/W can be obtained using the PCB copper ground layer with
16 vias connecting it to the contact area for the exposed pad. Ensure that the copper ground
area is a nominal 9 cm2 for 24 °C/W.
Figure 27 shows the derating curves for copper areas of 4 cm2 and 9 cm2.
As with most amplifiers, the power dissipated within the device depends primarily on the
supply voltage, the load impedance and the output modulation level.
The maximum estimated power dissipation for the TDA7491MV is less than 4 W. When
properly mounted on the above PCB the junction temperature could increase by 96 °C.
However, with a musical program the dissipated power is about 40% less, leading to a
temperature increase of around 60 °C. Even at the maximum recommended ambient
temperature for consumer applications of 50 °C there is still a clear safety margin before the
maximum junction temperature (150 °C) is reached.
Figure 27. Power derating curves for PCB used as heatsink
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DocID14576 Rev 4
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