TGA2533 View Datasheet(PDF) - TriQuint Semiconductor
Part Name
Description
MFG CO.
'TGA2533' PDF : 11 Pages View PDF
TGA2533
Ku-Band Power Amplifier
Product Compliance Information
ESD Information
ESD Rating:
Value:
Test:
Standard:
Class 0
< 250V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
ECCN
US Department of Commerce 3A001.b.2.c
Solderability
This part is compliant with EU 2002/95/EC RoHS
directive (Restrictions on the Use of Certain Hazardous
Substances in Electrical and Electronic Equipment).
This product also has the following attributes:
• Lead Free
• Halogen Free (Chlorine, Bromine)
• Antimony Free
• TBBP-A (C15H12Br402) Free
• PFOS Free
• SVHC Free
Assembly Notes
Component placement and adhesive attachment assembly notes:
• Vacuum pencils and/or vacuum collets are the preferred method of pick up.
• Air bridges must be avoided during placement.
• The force impact is critical during auto placement.
• Organic attachment (i.e. epoxy) can be used in low-power applications.
• Curing should be done in a convection oven; proper exhaust is a safety concern.
Reflow process assembly notes:
• Use AuSn (80/20) solder and limit exposure to temperatures above 300°C to 3-4 minutes, maximum.
• An alloy station or conveyor furnace with reducing atmosphere should be used.
• Do not use any kind of flux.
• Coefficient of thermal expansion matching is critical for long-term reliability.
• Devices must be stored in a dry nitrogen atmosphere.
Interconnect process assembly notes:
• Thermosonic ball bonding is the preferred interconnect technique.
• Force, time, and ultrasonics are critical parameters.
• Aluminum wire should not be used.
• Devices with small pad sizes should be bonded with 0.0007-inch wire.
Data Sheet: Rev A 05/19/11
© 2010 TriQuint Semiconductor, Inc.
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Disclaimer: Subject to change without notice
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