TGA2533 View Datasheet(PDF) - TriQuint Semiconductor
Part Name
Description
MFG CO.
'TGA2533' PDF : 11 Pages View PDF
TGA2533
Ku-Band Power Amplifier
Mechanical Information
3.000
2.892
1.175
0.108
0
161514 13 12
1
234 56
11 10 9
8 1.825
7
Unit: millimeters
Thickness: 0.10
Die x, y size tolerance: +/- 0.050
Chip edge to bond pad dimensions are shown to center of pad
Ground is backside of die
Bond Pad
1
2,16
3,15
4,14
5,13
6,12
7,11
8
9
10
Symbol
RF IN
Vg1
Vg2
Vg3
Vd1
Vd2
Vd3
RF OUT
Vdet
Vref
Pad Size
0.100 x 0.200
0.100 x 0.100
0.100 x 0.100
0.100 x 0.100
0.100 x 0.100
0.100 x 0.100
0.100 x 0.200
0.100 x 0.200
0.100 x 0.100
0.100 x 0.100
Data Sheet: Rev A 05/19/11
© 2010 TriQuint Semiconductor, Inc.
- 9 of 11 -
Disclaimer: Subject to change without notice
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