TPI12011NRL View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'TPI12011NRL' PDF : 9 Pages View PDF
TPI
4
Package information
Package information
● Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 5. SO-8 dimensions
b
e
ppp C
D
Seating
Plane
C
A2 A
C
A1
k
8
5
E1 E
1
4
Dimensions
Ref. Millimeters
Inches
h x 45°
Min. Typ. Max. Min. Typ. Max.
A
1.75
0.069
A1 0.1
L
A2 1.25
0.25 0.004
0.049
0.010
b 0.28
L1
C 0.17
0.48 0.011
0.23 0.007
0.019
0.009
D 4.80 4.90 5.00 0.189 0.193 0.197
E 5.80 6.00 6.20 0.228 0.236 0.244
E1 3.80 3.90 4.00 0.150 0.154 0.157
e
1.27
0.050
h 0.25
0.50 0.010
0.020
L 0.40
1.27 0.016
0.050
L1
1.04
0.041
k 0°
8° 0°
8°
ppp
0.10
0.004
Figure 11. SO-8 footprint, dimensions in mm (inches)
6.8
(0.268)
4.2
(0.165)
0.6
(0.024)
1.27
(0.050)
7/9
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