Qdatasheet_Logo
Integrated circuits, Transistor, Semiconductors Search and Datasheet PDF Download Site

TS4990 View Datasheet(PDF) - STMicroelectronics

Part Name
Description
MFG CO.
'TS4990' PDF : 32 Pages View PDF
TS4990
Package information
Figure 67. Package mechanical data for 9-bump flip-chip package
1.60 mm
Die size: 1.60 x 1.60 mm ±30µm
Die height (including bumps): 600µm
Bump diameter: 315µm ±50µm
1.60 mm Bump diameter before reflow: 300µm ±10µm
0.5mm
Bump height: 250µm ±40µm
Die height: 350µm ±20µm
Pitch: 500µm ±50µm
0.5mm
0.25mm
Coplanarity: 50µm max
100µm
600µm
* Back coating height: 100µm ±10µm
* Optional
Figure 68. Daisy chain mechanical data
1.6mm
3
2
1
1.6mm
AB C
The daisy chain sample features two-by-two pin connections. The schematics in Figure 68
illustrate the way pins connect to each other. This sample is used to test continuity on your
board. Your PCB needs to be designed the opposite way, so that pins that are unconnected
in the daisy chain sample, are connected on your PCB. If you do this, by simply connecting
an Ohmmeter between pin A1 and pin A3, the soldering process continuity can be tested.
25/32
Share Link: GO URL

All Rights Reserved © qdatasheet.com  [ Privacy Policy ] [ Contact Us ]