TS4990 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'TS4990' PDF : 32 Pages View PDF
Package information
TS4990
5.3
Note:
DFN8 package information
DFN8 exposed pad (E2 x D2) is connected to pin number 7. For enhanced thermal
performance, the exposed pad must be soldered to a copper area on the PCB, acting as a
heatsink. This copper area can be electrically connected to pin7 or left floating.
Figure 72. DFN8 3x3x0.90mm package mechanical drawing (pitch 0.5mm)
Table 9.
Ref.
A
A1
A2
A3
b
D
D2
E
E2
e
L
ddd
DFN8 3x3x0.90mm package mechanical data (pitch 0.5mm)
Dimensions
Millimeters
Mils
Min.
Typ.
Max.
Min.
Typ.
0.80
0.90
1.00
31.5
35.4
0.02
0.05
0.8
0.55
0.65
0.80
217
25.6
0.20
7.9
0.18
0.25
0.30
7.1
9.8
2.85
3.00
3.15
112.2
118.1
2.20
2.70
86.6
2.85
3.00
3.15
112.2
118.1
1.40
1.75
55.1
0.50
19.7
0.30
0.40
0.50
11.8
15.7
0.08
Max.
39.4
2.0
31.5
11.8
124
106.3
124
68.9
19.7
3.1
28/32
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