TSL2562, TSL2563
LOW-VOLTAGE
LIGHT-TO-DIGITAL CONVERTER
TAOS066N − AUGUST 2010
PACKAGE FN
TOP VIEW
MECHANICAL DATA
PIN 1
2000 + 75
VDD 1
ADR 2
GND 3
Dual Flat No-Lead
PIN OUT
TOP VIEW
6 DATA
5 INT
4 CLK
2000
+ 75
END VIEW
BOTTOM VIEW
Photo-Active Area
650 + 50
Seating Plane
SIDE VIEW
203 + 8
650
300
+ 50
PIN 1
750 + 150
Pb
Lead Free
NOTES: A. All linear dimensions are in micrometers. Dimension tolerance is ± 20 μm unless otherwise noted.
B. The photo-active area is 1398 μm by 203 μm.
C. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
D. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.
E. This package contains no lead (Pb).
F. This drawing is subject to change without notice.
Figure 25. Package FN — Dual Flat No-Lead Packaging Configuration
Copyright E 2010, TAOS Inc.
34
r
www.taosinc.com
The LUMENOLOGY r Company
r