PACKAGE CL-6
TOP VIEW
2.60
MECHANICAL DATA
TSL2562, TSL2563
LOW-VOLTAGE
LIGHT-TO-DIGITAL CONVERTER
TAOS066N − AUGUST 2010
Six-Lead Surface Mount Device
PIN OUT
TOP VIEW
5
4
2.20
6
3
SIDE VIEW
2.2
0.65
BOTTOM VIEW
Pin 1 Marker
Pin 1
Photo-Active Area
0.18
0.65
0.40
Pin 1
2
Pin 1 Marker
6
0.70
0.35
5
Pb
Lead Free
NOTES: A. All linear dimensions are in millimeters. Dimension tolerance is ± 0.10 mm unless otherwise noted.
B. The photo-active area is 1398 μm by 203 μm.
C. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
D. Contact finish is soft gold plate.
E. This package contains no lead (Pb).
F. This drawing is subject to change without notice.
Figure 26. Package CL — Six-Lead ChipLED Plastic Surface Mount Packaging Configuration
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www.taosinc.com
Copyright E 2010, TAOS Inc.
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