TSL2581FN View Datasheet(PDF) - TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS
Part Name
Description
MFG CO.
'TSL2581FN' PDF : 34 Pages View PDF
TSL2580, TSL2581
LIGHT-TO-DIGITAL CONVERTER
TAOS098 − MARCH 2010
MANUFACTURING INFORMATION
The package has been tested and have demonstrated an ability to be reflow soldered to a PCB substrate. The
process, equipment, and materials used in these test are detailed below.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The components should
be limited to a maximum of three passes through this solder reflow profile.
Table 15. TSL2580/81 Solder Reflow Profile
PARAMETER
Average temperature gradient in preheating
Soak time
Time above 217°C
Time above 230°C
Time above Tpeak −10°C
Peak temperature in reflow
Temperature gradient in cooling
REFERENCE
tsoak
t1
t2
t3
Tpeak
TSL2580/81
2.5°C/sec
2 to 3 minutes
Max 60 sec
Max 50 sec
Max 10 sec
260° C (−0°C/+5°C)
Max −5°C/sec
Tpeak
T3
T2
T1
Not to scale — for reference only
Time (sec)
t3
t2
tsoak
t1
Figure 23. TSL2580/TSL2581 Solder Reflow Profile Graph
Copyright E 2010, TAOS Inc.
32
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