TSL2581FN View Datasheet(PDF) - TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS
Part Name
Description
MFG CO.
'TSL2581FN' PDF : 34 Pages View PDF
TSL2580, TSL2581
LIGHT-TO-DIGITAL CONVERTER
MANUFACTURING INFORMATION
TAOS098 − MARCH 2010
Moisture Sensitivity
Optical characteristics of the device can be adversely affected during the soldering process by the release and
vaporization of moisture that has been previously absorbed into the package molding compound. To ensure the
package molding compound contains the smallest amount of absorbed moisture possible, each device is
dry-baked prior to being packed for shipping. Devices are packed in a sealed aluminized envelope with silica
gel to protect them from ambient moisture during shipping, handling, and storage before use.
CS package
The CS package has been assigned a moisture sensitivity level of MSL 2 and the devices should be stored under
the following conditions:
Temperature Range
Relative Humidity
Floor Life
5°C to 50°C
60% maximum
1 year out of bag at ambient < 30°C / 60% RH
Rebaking will be required if the aluminized envelope has been open for more than 1 year. If rebaking is required,
it should be done at 90°C for 3 hours.
FN package
The FN package has been assigned a moisture sensitivity level of MSL 3 and the devices should be stored under
the following conditions:
Temperature Range
Relative Humidity
Total Time
Opened Time
5°C to 50°C
60% maximum
6 months from the date code on the aluminized envelope — if unopened
168 hours or fewer
Rebaking will be required if the devices have been stored unopened for more than 6 months or if the aluminized
envelope has been open for more than 168 hours. If rebaking is required, it should be done at 90°C for 4 hours.
The LUMENOLOGY r Company
r
r
www.taosinc.com
Copyright E 2010, TAOS Inc.
33
Share Link: 
