UPD703017AGC View Datasheet(PDF) - NEC => Renesas Technology
Part Name
Description
MFG CO.
'UPD703017AGC' PDF : 48 Pages View PDF
µPD703014A, 703014AY, 703015A, 703015AY, 703017A, 703017AY
4. RECOMMENDED SOLDERING CONDITIONS
The µPD703014A, 703014AY, 703015A, 703015AY, 703017A, and 703017AY should be soldered and mounted
under the following recommended conditions.
For the details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact your NEC sales
representative.
Table 4-1. Surface Mounting Type Soldering Conditions
(1) µPD703014AGC-×××-8EU: 100-pin plastic LQFP (fine-pitch) (14 × 14)
µPD703014AYGC-×××-8EU: 100-pin plastic LQFP (fine-pitch) (14 × 14)
µPD703015AGC-×××-8EU: 100-pin plastic LQFP (fine-pitch) (14 × 14)
µPD703015AYGC-×××-8EU: 100-pin plastic LQFP (fine-pitch) (14 × 14)
µPD703017AGC-×××-8EU: 100-pin plastic LQFP (fine-pitch) (14 × 14)
µPD703017AYGC-×××-8EU: 100-pin plastic LQFP (fine-pitch) (14 × 14)
Soldering Method
Soldering Conditions
Recommended
Condition
Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Two times or less
Exposure limit: 7 daysNote (after that, prebake at 125°C for 10 hours)
IR35-107-2
VPS
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: Two times or less
Exposure limit: 7 daysNote (after that, prebake at 125°C for 10 hours)
VP15-107-2
Partial heating
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
–
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
(2) µPD703014AF1-×××-EA6: 121-pin plastic FBGA (12 × 12)
µPD703014AYF1-×××-EA6: 121-pin plastic FBGA (12 × 12)
µPD703015AF1-×××-EA6: 121-pin plastic FBGA (12 × 12)
µPD703015AYF1-×××-EA6: 121-pin plastic FBGA (12 × 12)
µPD703017AF1-×××-EA6: 121-pin plastic FBGA (12 × 12)
µPD703017AYF1-×××-EA6: 121-pin plastic FBGA (12 × 12)
Soldering Method
Soldering Conditions
Recommended
Condition
Symbol
Infrared reflow
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Two times or less
Exposure limit: 7 daysNote (after that, prebake at 125°C for 10 hours)
IR35-107-2
Partial heating
Pin temperature: 300°C max., Time: 3 seconds max. (per pin row)
–
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
44
Data Sheet U14526EJ2V0DS00
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