USB2512BI/M2 View Datasheet(PDF) - Microchip Technology
Part Name
Description
MFG CO.
'USB2512BI/M2' PDF : 57 Pages View PDF
USB251xB/xBi
6.0 DC PARAMETERS
6.1 Maximum Ratings
Parameter
Symbol
MIN
Storage
TSTOR
-55
Temperature
Lead
Temperature
3.3 V supply
voltage
VDD33
VDDA33
Voltage on any
-0.5
I/O pin
Voltage on
-0.5
XTALIN
Voltage on
-0.5
XTALOUT
MAX
150
4.6
5.5
4.0
2.5
Units
°C
V
V
V
V
Comments
Refer to JEDEC Specification J-STD-
020D [5]
Applies to all packages
Note 6-1
• Stresses above the specified parameters could cause permanent damage to the device. This is a stress rating
only. Therefore, functional operation of the device at any condition above those indicated in the operation sec-
tions of this specification are not implied.
• When powering this device from laboratory or system power supplies, it is important that the absolute maximum
ratings not be exceeded or device failure can result. Some power supplies exhibit voltage spikes on their outputs
when the AC power is switched on or off. In addition, voltage transients on the AC power line may appear on the
DC output. When this possibility exists, it is suggested that a clamp circuit be used.
6.2 Operating Conditions
Parameter
Extended Commercial
Operating Temperature
Industrial
Operating Temperature
Symbol
TAE
TAI
3.3 V supply voltage
3.3 V supply rise time
Voltage on any I/O pin
VDD33
VDDA33
tRT33
Voltage on XTALIN
MIN
MAX
Units
Comments
0
85
°C Ambient temperature in still air
-40
85
°C Ambient temperature in still air
3.0
3.6
Only applies to USB251xBi products
V Applies to all parts
0
400
-0.3
5.5
-0.3
VDD33
s See Figure 6-1 and Note 6-2
V
If any 3.3 V supply voltage drops
below 3.0 V, then the MAX
becomes:
(3.3 V supply voltage) + 0.5
V
2010 - 2015 Microchip Technology Inc.
DS00001692C-page 39
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