WED2ZLRSP01S50BC View Datasheet(PDF) - White Electronic Designs Corporation

Part Name

Description

MFG CO.

WED2ZLRSP01S50BC

512K x 32/256K x 32 Dual Array Synchronous Pipeline Burst NBL SRAM

White Electronic Designs Corporation 

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White Electronic Designs

WED2ZLRSP01S

PACKAGE DIMENSION: 153 BUMP PBGA

17.00

23.00

2.33 Max

10.00

3.50

0.50 ± 10

18.00

1.00

2.5

.60 ± .050

ALL LINEAR DIMENSIONS ARE IN MILLIMETERS AND PARENTHETICALLY IN INCHES

NOTE: Ball attach pad for above BGA package is 620 microns in diameter. Pad is solder mask defined.

Part Number

WED2ZLRSP01S35BC

WED2ZLRSP01S38BC

WED2ZLRSP01S42BC

WED2ZLRSP01S50BC

WED2ZLRSP01S38BI

WED2ZLRSP01S42BI

WED2ZLRSP01S50BI

ORDERING INFORMATION

Commercial Temp Range (0°C to 70°C)

Configuration

tCD Clock Operating Temperature

(ns) (MHz)

Range

Range

512K x 32/256K x 32 3.5

166 Commercial 0° - 70° C

512K x 32/256K x 32 3.8

150 Commercial 0° - 70°C

512K x 32/256K x 32 4.2

133 Commercial 0° - 70°C

512K x 32/256K x 32 5.0

100 Commercial 0° - 70°C

512K x 32/256K x 32 3.8

150

Industrial -40° - 85°C

512K x 32/256K x 32 4.2

133

Industrial -40° - 85°C

512K x 32/256K x 32 5.0

100

Industrial -40° - 85°C

White Electronic Designs Corp. reserves the right to change products or specifications without notice.

April, 2002

Rev. 0

13

White Electronic Designs Corporation • (602) 437-1520 • www.wedc.com

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