WM8782A View Datasheet(PDF) - Cirrus Logic
Part Name
Description
MFG CO.
'WM8782A' PDF : 20 Pages View PDF
Production Data
WM8782A
ABSOLUTE MAXIMUM RATINGS
Absolute Maximum Ratings are stress ratings only. Permanent damage to the device may be caused by continuously
operating at or beyond these limits. Device functional operating limits and guaranteed performance specifications are given
under Electrical Characteristics at the test conditions specified.
ESD Sensitive Device. This device is manufactured on a CMOS process. It is therefore generically susceptible
to damage from excessive static voltages. Proper ESD precautions must be taken during handling and storage
of this device.
Wolfson tests its package types according to IPC/JEDEC J-STD-020B for Moisture Sensitivity to determine acceptable storage
conditions prior to surface mount assembly. These levels are:
MSL1 = unlimited floor life at <30°C / 85% Relative Humidity. Not normally stored in moisture barrier bag.
MSL2 = out of bag storage for 1 year at <30°C / 60% Relative Humidity. Supplied in moisture barrier bag.
MSL3 = out of bag storage for 168 hours at <30°C / 60% Relative Humidity. Supplied in moisture barrier bag.
The Moisture Sensitivity Level is specified in Ordering Information.
CONDITION
Digital supply voltage
Analogue supply voltage
Voltage range digital inputs
Voltage range analogue inputs
Ambient temperature (supplies applied)
Storage temperature
Pb free package body temperature (reflow 10 seconds)
Package body temperature (soldering 2 minutes)
Notes:
1. Analogue and digital grounds must always be within 0.3V of each other.
MIN
-0.3V
-0.3V
DGND -0.3V
AGND -0.3V
-55°C
-65°C
MAX
+4.5V
+7V
DVDD + 0.3V
AVDD +0.3V
+125°C
+150°C
+260°C
+183°C
THERMAL PERFORMANCE
PARAMETER
Thermal resistance – junction to
ambient
SYMBOL
RθJA
TEST CONDITIONS
MIN
TYP
81
See note 1
MAX
Notes:
1. Figure given for package mounted on 4-layer FR4 according to JESD51-7. (No forced air flow is assumed).
2. Thermal performance figures are estimated.
UNIT
°C/W
w
PD, April 2010, Rev 4.8
5
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