CABGA(2022) Datasheet PDF - Amkor Technology

AMKOR OVERVIEW
   Amkor entered volume manufacturing in 2013. Five package families (laminate/leadframe) are in volume production with >50 other packages under qualification and evaluation.

KEY FEATURES
► Ag-Alloy wire is softer than Cu wire
   resulting in lower Al-Splash and lower
   risk of bond pad damage
► Ag-Alloy wire has a wide
   process window that improves
   manufacturability for devices with
   fragile bond pad structures

BenefitS
Ag-Alloy wire is the best low-cost replacement for applications that need:
► Die-to-die bonding, waterfall bonding
   and very thin AI pad
► Ultra-fine bond pad pitch (BPP) and
   small bond pad openings (BPO) with
   less AI splash
► Ultra-low loop height
► Ag alloy has higher resistivity than Au
   and PCC