Part Name
Description
View
Low Profile Quad Flat Pack (LQFP)
Plastic Ball Grid Array (PBGA)
Ceramic Dual-Inline Package
Ceramic Dual-Inline Package
Ceramic Quad Flat Pack Package
The PSMC package is part of the FLAT series of compact surface mount packages which allow miniaturization
TOLL (TO-Leadless) is a highly efficient space-saving package designed for currents up to 300A in automotive applications
Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide
Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide
Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide
Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide
Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide
Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide
Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide
Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide
Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide
Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide
Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide
Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide
Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide
Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide
Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide
Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide
Silver Wirebonding (Rev : 2022 )
ChipArray® Packages (Rev : 2007 )
ChipArray® Packages (Rev : 2007 )
ChipArray® Packages (Rev : 2007 )