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CQFP Datasheet PDF - Amkor Technology

CQFP image

Part Name
CQFP

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page
1 Pages

File Size
329.2 kB

MFG CO.
AMKOR
Amkor Technology AMKOR

Ceramic Quad Flat Pack
Package (CQFP)

Amkor Technology is continuing to service this established industry package. The Amkor Technology CQFP capability provides you, the customer, with a wide range of lead counts and body sizes available from various suppliers. The CQFP is a hermetic package consisting of two pieces of dry pressed ceramic surrounding a "gullwing" formed leadframe. The ceramic / LF / ceramic system is held together hermetically by glass. The frit lid is sealed/reflowed over the package cavity at temperatures between 400° - 460° Centigrade.


FEATUREs:
The CQFP offers a variety of features:
• Square package body
• 14-256 lead count, 25-50 mil lead pitchs
• Hermetic package
• High thermal conductive ceramic
• Solder Plate lead finish
• JEDEC standard compliant
• Wide selection of available cavity sizes to
   meet most die size needs
• Commercial or full Military flows


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