CABGA-VFBGA Datasheet PDF - Amkor Technology

ChipArray® CABGA/FBGA

   Amkor’s ChipArray® Ball Grid Array (CABGA) laminate based packages are compatible with SMT mounting processes worldwide. The near chip size CABGA fine-pitch BGA (FBGA) offers a broad selection of ball array pitches (≥0.3 mm pitch), ball counts and body sizes (1.5 mm to 27 mm body), single and multi-die layouts, stacked die (1-16) and passive component integration.

FEATURES
â–º Cutting-edge technology and
   expanding package offerings provide
   a platform from prototype-toproduction
â–º Copper (Cu) wire interconnect method
   and high-volume infrastructure at all
   Amkor CABGA production facilities
â–º Lowest cost using Amkor standard
   CABGA bill of materials selection
â–º 1.5-27 mm body size available
â–º Square or rectangle packages
   available
â–º 4-700 ball/lead counts
â–º 0.4, 0.5, 0.65, 0.75, 0.80 & 1.0 mm ball
   pitch available
â–º JEDEC publication 95 design guide 4.5
   (JEP95)
â–º RoHS-6 (green) BOM options for 100%
   of CABGA family
â–º Thermal conductivity epoxy (8 W/mk)
   and thermal conductivity compound
   (3 W/mK) are available

APPLICATIONs
   The ChipArray® package family is applicable for a wide range of semiconductors from high end FPGAs, ASICS to memory, analog, RF devices, MCUs and simple PLDs requiring a package size smaller than conv entional PBGAs or leadframe packages. ChipArray® packages fill the need for the low cost, minimum space, high performance and reliability requirements of mobile and gaming devices, notebooks, personal computers, networking, automotive and industrial applications.