ADSP-21369 View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
'ADSP-21369' PDF : 60 Pages View PDF
ADSP-21367/ADSP-21368/ADSP-21369
10
8
6
4
2
0
-2
-4
0
y = 0.0488x - 1.5923
50
100
150
200
LOAD CAPACITANCE (pF)
Figure 45. Typical Output Delay or Hold vs. Load Capacitance
(at Junction Temperature)
8
6
y = 0.0256x - 0.021
4
2
0
-2
0
50
100
150
200
LOAD CAPACITANCE (pF)
Figure 46. SDCLK Typical Output Delay or Hold vs. Load Capacitance
(at Junction Temperature)
THERMAL CHARACTERISTICS
The ADSP-21367/ADSP-21368/ADSP-21369 processors are
rated for performance over the temperature range specified in
Operating Conditions on Page 16.
Table 44 and Table 45 airflow measurements comply with
JEDEC standards JESD51-2 and JESD51-6 and the junction-to-
board measurement complies with JESD51-8. Test board design
complies with JEDEC standards JESD51-9 (BGA_ED) and
JESD51-8 (LQFP_EP). The junction-to-case measurement com-
plies with MIL-STD-883. All measurements use a 2S2P JEDEC
test board.
The LQFP-EP package requires thermal trace squares and ther-
mal vias, to an embedded ground plane, in the PCB. Refer to
JEDEC standard JESD51-5 for more information.
To determine the junction temperature of the device while on
the application PCB, use:
TJ = TTOP + (ΨJT × PD)
where:
TJ = junction temperature (°C)
TTOP = case temperature (°C) measured at the top center of the
package
ΨJT = junction-to-top (of package) characterization parameter is
the typical value from Table 44 and Table 45.
PD = power dissipation (see EE Note EE-299)
Values of θJA are provided for package comparison and PCB
design considerations. θJA can be used for a first-order approxi-
mation of TJ by the equation:
TJ = TA + (θJA × PD)
where:
TA = ambient temperature (°C)
Values of θJC are provided for package comparison and PCB
design considerations when an external heat sink is required.
This is only applicable when a heat sink is used.
Values of θJB are provided for package comparison and PCB
design considerations. The thermal characteristics values pro-
vided in Table 44 and Table 45 are modeled values @ 2 W.
Table 44. Thermal Characteristics for 256-Ball BGA_ED
Parameter
θJA
θJMA
θJMA
θJC
θJB
ΨJT
ΨJMT
ΨJMT
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
12.5
10.6
9.9
0.7
5.3
0.3
0.3
0.3
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Table 45. Thermal Characteristics for 208-Lead LQFP EPAD
(With Exposed Pad Soldered to PCB)
Parameter
θJA
θJMA
θJMA
θJC
ΨJT
ΨJMT
ΨJMT
ΨJB
ΨJMB
ΨJMB
Condition
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Airflow = 0 m/s
Airflow = 1 m/s
Airflow = 2 m/s
Typical
17.1
14.7
14.0
9.6
0.23
0.39
0.45
11.5
11.2
11.0
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Rev. C | Page 48 of 56 | January 2008
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