AT91SAM9263B-CU View Datasheet(PDF) - Atmel Corporation

Part Name

Description

MFG CO.

AT91SAM9263B-CU

AT91SAM ARM-based Embedded MPU

Atmel Corporation 

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11. Package Drawings

11.1 Package Drawing AT91SAM9263B-CU

Figure 11-1. 324-ball TFBGA Package Drawing

Table 11-1. Soldering Information

Ball Land

Soldering Mask Opening

0.4 mm +/- 0.05

0.275 mm +/- 0.03

Table 11-2. Device and 324-ball TFBGA Package Maximum Weight

572

mg

Table 11-3. 324-ball TFBGA Package Characteristics

Moisture Sensitivity Level

3

Table 11-4. Package Reference

JEDEC Drawing Reference

JESD97 Classification

MO-210

e1

This package respects the recommendations of the NEMI User Group.

SAM9263 [Summary] 44

6249IS–ATARM–28-Jan-13

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