AT91SAM9263B-CU View Datasheet(PDF) - Atmel Corporation

Part Name

Description

MFG CO.

AT91SAM9263B-CU

AT91SAM ARM-based Embedded MPU

Atmel Corporation 

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11.2 Package Drawing (AT91SAM9263B-CU-100)

Figure 11-2. 324-ball TFBGA Package Drawing

Table 11-5. Soldering Information

Ball Land

Solder Mask Opening

0.4 mm +/- 0.05

0.275 mm +/- 0.03

Table 11-6. Device and 324-ball TFBGA Package Maximum Weight

572

mg

Table 11-7. 324-ball TFBGA Package Characteristics

Moisture Sensitivity Level

3

Table 11-8. Package Reference

JEDEC Drawing Reference

JESD97 Classification

MO-275

e8

This package respects the recommendations of the NEMI User Group.

SAM9263 [Summary] 45

6249IS–ATARM–28-Jan-13

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