DSM2180F3 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
DSM2180F3
STMicroelectronics
'DSM2180F3' PDF : 63 Pages View PDF
DSM2180F3
PACKAGE MECHANICAL
In order to meet environmental requirements, ST
offers the DSM2180F3V in ECOPACK® packag-
es. These packages have a Lead-free second-lev-
el interconnect. The category of second-level
interconnect is marked on the package and on the
inner box label, in compliance with JEDEC Stan-
dard JESD97.
The maximum ratings related to soldering condi-
tions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK speci-
fications are available at: www.st.com.
PLCC52 – 52 lead Plastic Leaded Chip Carrier, rectangular
D
D1
M
A1
A2
M1
1N
b1
te Product(s) PLCC-B
E1 E
L
D2/E2 D3/E3
e
b
L1
C
A
CP
- Obsole Note: Drawing is not to scale.
t(s) PLCC52 – 52 lead Plastic Leaded Chip Carrier, rectangular
duc Symbol
Typ.
mm
Min.
Max.
Typ.
ro A
4.19
4.57
P A1
2.54
2.79
te A2
–
0.91
le B
0.33
0.53
oB1
0.66
0.81
bsC
0.246
0.261
OD
19.94
20.19
inches
Min.
0.165
0.100
–
0.013
0.026
0.0097
0.785
Max.
0.180
0.110
0.036
0.021
0.032
0.0103
0.795
D1
19.05
19.15
0.750
0.754
D2
17.53
18.54
0.690
0.730
E
19.94
20.19
0.785
0.795
E1
19.05
19.15
0.750
0.754
E2
17.53
18.54
0.690
0.730
57/63
Share Link: 