EMIF02-SPK02F2 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'EMIF02-SPK02F2' PDF : 12 Pages View PDF
EMIF02-SPK02F2
2-line IPAD™, EMI filter and ESD protection
Features
■ Packaged in lead-free Flip Chip
■ Very low resistance: 0.35 Ω
■ High attenuation: -45 dB at 900 MHz
■ Very low PCB space consumption:
0.89 mm x 1.26 mm
■ Very thin package: 0.65 mm
■ High efficiency in ESD suppression
IEC6 1000-4-2 level 4
■ High reliability offered by monolithic integration
■ High reduction of parasitic elements through
integration and wafer level packaging
Complies with the following standards
■ IEC 61000-4-2 level 4:
– ±15 kV (air discharge)
– ±8 kV (contact discharge)
Application
■ Mobile phones
Description
The EMIF02-SPK02F2 chip is a highly integrated
device designed to suppress EMI/RFI noise for
interface line filtering.
The EMIF02-SPK02F2 flip-chip packaging means
the package size is equal to the die size. That's
why the EMIF02-SPK02F2 is a very small device.
Additionally, this filter includes ESD protection
circuitry, which prevents damage to the protected
device when subjected to ESD surges up 30 kV.
Datasheet − production data
Flip-Chip package
(5 bumps)
Figure 1. Pin configuration (bump side)
321
O1
I1
A
GND
B
O2
I2
C
Figure 2. Functional schematic
Input
Output
April 2012
This is information on a product in full production.
TM: IPAD is a trademark of STMicroelectronics
Doc ID 15035 Rev 3
1/12
www.st.com
12
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