Data Sheet
AD5689R/AD5687R
OUTLINE DIMENSIONS
PIN 1
INDICATOR
0.80
0.75
0.70
SEATING
PLANE
3.10
3.00 SQ
2.90
TOP VIEW
0.50
BSC
0.30
0.23
0.18
13
12
16
1
EXPOSED
PAD
PIN 1
INDICATOR
1.75
1.60 SQ
1.45
0.50
0.40
9
8
4
5
BOTTOM VIEW
0.25 MIN
0.30
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WEED-6.
Figure 55. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
3 mm × 3 mm Body, Very Very Thin Quad
(CP-16-22)
Dimensions shown in millimeters
5.10
5.00
4.90
16
9
4.50
4.40
6.40
BSC
4.30
1
8
PIN 1
1.20
0.15
MAX
0.20
0.05
0.09
0.75
0.30
8°
0.60
0.65
BSC
0.19
COPLANARITY
SEATING
PLANE
0°
0.45
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 56. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
Rev. B | Page 27 of 28