EVAL-SDP-CB1Z View Datasheet(PDF) - Analog Devices
Part Name
Description
MFG CO.
'EVAL-SDP-CB1Z' PDF : 80 Pages View PDF
ADAS1000/ADAS1000-1/ADAS1000-2
ABSOLUTE MAXIMUM RATINGS
Table 7.
Parameter
AVDD to AGND
IOVDD to DGND
ADCVDD to AGND
DVDD to DGND
REFIN/REFOUT to REFGND
ECG and Analog Inputs to AGND
Digital Inputs to DGND
REFIN to ADCVDD
AGND to DGND
REFGND to AGND
ECG Input Continuous Current
Storage Temperature Range
Operating Junction Temperature Range
Reflow Profile
Junction Temperature
ESD
HBM
FICDM
Rating
−0.3 V to +6 V
−0.3 V to +6 V
−0.3 V to +2.5 V
−0.3 V to +2.5 V
−0.3 V to +2.1 V
−0.3 V to AVDD + 0.3 V
−0.3 V to IOVDD + 0.3 V
ADCVDD + 0.3 V
−0.3 V to + 0.3 V
−0.3 V to + 0.3 V
±10 mA
−65°C to +125°C
−40°C to +85°C
J-STD 20 (JEDEC)
150°C max
2500 V
1000 V
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Data Sheet
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 8. Thermal Resistance1
Package Type
θJA
56-Lead LFCSP
35
64-Lead LQFP
42.5
Unit
°C/W
°C/W
1 Based on JEDEC standard 4-layer (2S2P) high effective thermal conductivity
test board (JESD51-7) and natural convection.
ESD CAUTION
Rev. C | Page 14 of 85
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