HC4P5524-5 View Datasheet(PDF) - Harris Semiconductor
Part Name
Description
MFG CO.
'HC4P5524-5' PDF : 12 Pages View PDF
HC-5524
Pin Descriptions (Continued)
DIP/SO
IC
PLCC SYMBOL
DESCRIPTION
NA
42
RF2
Tie directly to RF1 in the PLCC application.
27
43
VB-
The battery voltage source. The most negative supply.
28
44
BG
Battery Ground - To be connected to zero potential. All loop current and some quiescent current flows
(Note 4) into this ground terminal.
1, 5, 6,
7, 14,
15, 16,
21, 23,
26, 28,
29, 30,
40
NC
No internal connection.
NOTES:
4. All grounds (AG, BG, and DG) must be applied before VB+ or VB-. Failure to do so may result in premature failure of the part. If a user
wishes to run separate grounds off a line card, the AG must be applied first.
5. Although not used in the typical applications circuit, VFB may be used in matching complex 2-Wire impedances.
Functional Diagram
DIP OR SOIC
R
25
TF
TF -
+
14
TIP
R
R
R
R
4.5kΩ
VRX
OUT1
R
17
12
-IN1
13
VFB
24
2R
-
+
OP AMP
R/2
RF1
2R
2R
- TA
+
2R
SHD
15
RING
16
RFS
100kΩ
100kΩ
100kΩ
100kΩ
4.5kΩ
25kΩ
- LA
+
25kΩ
90kΩ
90kΩ
90kΩ
RTD
GKD
FAULT
DET
26
RF
R = 108kΩ
-
+
RF
90kΩ
3
C1
VB/2
REF
18
C2
-
+
GM
VTX
19
VB+
2
DG
22
AG
1 28
BG
BIAS
NETWORK
27
VB-
THERM
LTD
SH
TSD
GK
RFC
4
F1
5
F0
6
RS
9
TST
20
PRI
21
PR
23
RD
7
SHD
8
GKD
10
ALM
RF2
11
ILIMIT
6
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