L6245 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'L6245' PDF : 15 Pages View PDF
THERMAL CHARACTERISTICS
On the application, the L6245 must be soldered
on a PCB system. The Traks Area, depending on
the lenght and the width of each track, must be
between 2 to 10 square mm. An area of 10 mm2
can give a typ. Thermal Resistance Junction-to-
Ambient value of 85°C/W (See Fig. 2): this value
refer3 to a Total Power Dissipated Power of 1W.
Figure 2: Typical Rth j-amb vs. Tracks Area on PCB
L6245
Fig. 9 shows the increase of the Rth j-amb when
the Dissipated Power decreases.
Practically, very useful information is the change
of the thermal resistance (Thermal Impedance)
versus a single pulse of power width or versus the
time the dissipation begins.
Fig. 4 shows this Thermal Impedance trend.
Figure 3: Typical Junction-to-Ambient Thermal
Resistance vs. Total Dissipated
Power. (L6245 mounted on a typical
PCB)
Figure 4: Typical Transient Thermal Impedance
vs. Time or Pulse Width. (L6245
mounted on a typical PCB)
13/15
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