L6919E View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'L6919E' PDF : 33 Pages View PDF
L6919E
to consider when designing such high current applications.
A good layout solution can generate a benefit in lowering power dissipation on the power paths, reducing radi-
ation and a proper connection between signal and power ground can optimize the performance of the control
loops.
Integrated power drivers reduce components count and interconnections between control functions and drivers,
reducing the board space.
Here below are listed the main points to focus on when starting a new layout and rules are suggested for a cor-
rect implementation.
s Power Connections.
These are the connections where switching and continuous current flows from the input supply towards the load.
The first priority when placing components has to be reserved to this power section, minimizing the length of
each connection as much as possible.
To minimize noise and voltage spikes (EMI and losses) these interconnections must be a part of a power plane
and anyway realized by wide and thick copper traces. The critical components, i.e. the power transistors, must
be located as close as possible, together and to the controller.
Considering that the "electrical" components reported in figure are composed by more than one "physical" com-
ponent, a ground plane or "star" grounding connection is suggested to minimize effects due to multiple connec-
tions.
Figure 16. Power connections and related connections layout guidelines (same for both phases)
HGATEx
PHASEx
LGATEx
PGNDx
Rgate HS
VIN
Rgate LS
L
D
CIN
COUT
LOAD
a. PCB power and ground planes areas
BOOTx
CBOOTx
HS
PHASEx
+VCC
VCC
LS
SGND
CVCC
VIN
L
D
CIN
COUT
LOAD
b. PCB small signal components placement
Fig. 16a shows the details of the power connections involved and the current loops. The input capacitance (CIN),
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