L99H01 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'L99H01' PDF : 53 Pages View PDF
L99H01
5
Packages thermal data
Packages thermal data
Figure 12. PowerSSO-36 Rthj-amb vs. PCB copper area in open free air condition
RTHj_amb(°C/W)
65
60
55
50
45
40
35
0
2
4
6
8
10
PCB Cu heatsink area (cm^2)
1. Layout condition of Rth and Zth measurements (PCB: double layer, thermal vias,
FR4 area = 129 mm x 60 mm, PCB thickness =1.6 mm, Cu thickness =70 µm (front and back side),
Copper areas: from minimum pad layout to 8 cm2).
DocID15567 Rev 5
43/53
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