L99H01 View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'L99H01' PDF : 53 Pages View PDF
L99H01
Package and packing information
6.3
Packages thermal data
Figure 14. LQFP32 Rthj-amb vs. PCB copper area in open box free air condition
RTHj_amb(°C/W)
81
80
79
78
77
76
75
0
0.2
0.4
0.6
0.8
1
PCB Cu heatsink area (cm^2)
1. Layout condition of Rth and Zth measurements (PCB: double layer, thermal vias,
FR4 area = 78 mm x 86 mm, PCB thickness =1.6 mm, Cu thickness =70 µm (front and back side), copper
areas: from minimum pad layout to 8 cm2).
DocID15567 Rev 5
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