LPC1767 View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
MFG CO.
'LPC1767' PDF : 79 Pages View PDF
NXP Semiconductors
LPC1769/68/67/66/65/64/63
32-bit ARM Cortex-M3 microcontroller
9. Thermal characteristics
The average chip junction temperature, Tj (°C), can be calculated using the following
equation:
Tj = Tamb + (PD × Rth(j – a))
(1)
• Tamb = ambient temperature (°C),
• Rth(j-a) = the package junction-to-ambient thermal resistance (°C/W)
• PD = sum of internal and I/O power dissipation
The internal power dissipation is the product of IDD and VDD. The I/O power dissipation of
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
Table 6. Thermal characteristics
VDD = 2.4 V to 3.6 V; Tamb = −40 °C to +85 °C unless otherwise specified;
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Tj(max)
maximum junction
temperature
-
-
125
°C
LPC1769_68_67_66_65_64_63
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 5 April 2011
© NXP B.V. 2011. All rights reserved.
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