LRS13023 View Datasheet(PDF) - Sharp Electronics
Part Name
Description
MFG CO.
'LRS13023' PDF : 61 Pages View PDF
SHARI=
LRS13023
52
4. Packing Specification (Embossed Carrier Taping Specification)
This standard apply to the embossed carrier taping specificat ion for ICs
to be delivered from SHARP CORPORATION. SHARP’s embossed carrier taping
specification
are generally based on those set forth by the Japanese Industrial
Standard JIS C 0806 and the EIA481A.
4 - 1. Tape Structure
. Embossed carrier tape is made of conductive plastic. The embossed portions
of the carrier tape are filled with IC packages and covered with a top
covering tape to enclose them.
4-2. Taping Reel and Embossed Carrier Tape Size
*For the taping reel and embossed carrier tape sizes, refer to the attached
drawings (NO.CV674 and CV755)
4-3. IC Package Enclosure in Embossed Carrier Tape
*The IC package enclosure direction in the embossed portion as it compares
to the direction in Which the tape is pulled is indicated by an index mark
on package (Index mark indicate the NO.1 pin on package) in the attached
drawing (NO. CV522).
4 -4. Missing IC Packages inside Embossed Carrier Tape
*The number of missing IC packages inside the embossed carrier tape should
not exceed 0.1% of the total enclosed in the tape per reel, or 1,
Whichever may be larger.There should never be more than two consecutive
missing IC package.
4 - 5. Tape Joints
-The embossed carrier tape should not have more than one joint per reel.
4-6. Peeling Strength of the Top Covering Tape
*Peeling strength must meet the following conditions.
1) Peeling angle
at 165” to 180”
2) Peeling speed
at 300mm/min.
3) Peeling strength
at 0.2 to 0.7N(ZO to 70gf)
DHAIINC DlHECTIO#
[EMHOSED cARRIm rAPE
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