LRS13023 View Datasheet(PDF) - Sharp Electronics
Part Name
Description
MFG CO.
'LRS13023' PDF : 61 Pages View PDF
SHARP
LRS13023
54
5- 1. Store under conditions shown below before opening the dry packing
(1) Temperature range : 5-40x
(2) Humidity
: 80% RH or less
5-2. Notes on opening the dry packing
Before opening the dry packing, prepare a working table which is
grounded against ESD and use a grounding strap.
5-3. Storage after opening the dry packing
Perform the following to prevent absorption of moisture after opening,
( 1) After opening the dry packing, store the ICs in an environment with a
temperature of 5--25°C and a relative humidity of 60% or less and
mount ICs within 3 days after opening dry packing.
(2) To re-store the ICs for an extended period of time within 3 days after
opening the dry packing, use a dry box or re-seal the ICs in the dry
packing with desiccant (whoes indicater is blue), and store in an
environment with a temperature of 5-40°C and a relative humidity of
80% or less, and mount ICs within 2 weeks.
(3) Total period of storage after first opening and re-opening is within
3 days, and store the ICs in the same environment as sect ion 5-3. (1).
First opening+ X1 +re-sealing+
Y +re-opening-
Xz -mount ing
-
ICs in dry !
5--25x
i
5 -40°C
5~25°C
packing i 60%RH or less i 8O%RH or less j 60%RH or less (
5 - 4.
Baking (drying) before mounting
( 1) Baking is necessary
(A) If the humidity indicator in the desiccant becomes pink
(B) If the procedure in section 5-3 could not be per formed
( 2) Recommended baking conditions
If the above conditions (A) and (B) are applicab le, bake it be fore
mounting. The recommended conditions are 16-24 hours at 120°C or 5-10
hours at 150°C. Note that the embossed carrier tape can not be baked
at the above temperature. Please transfar ICs to heat resistant carrier.
(3) Storage after baking
After baking ICs, store the ICs in the same environment as section
5-3.(l).
Share Link: 
