LTC5587IDD View Datasheet(PDF) - Linear Technology
Part Name
Description
MFG CO.
'LTC5587IDD' PDF : 20 Pages View PDF
PACKAGE DESCRIPTION
DD Package
12-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1725 Rev A)
LTC5587
0.70 ±0.05
3.50 ±0.05
2.10 ±0.05
2.38 ±0.05
1.65 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.45 BSC
2.25 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
R = 0.115
TYP
7
0.40 ± 0.10
12
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
3.00 ±0.10
(4 SIDES)
0.75 ±0.05
0.00 – 0.05
2.38 ±0.10
1.65 ± 0.10
PIN 1 NOTCH
R = 0.20 OR
0.25 × 45°
CHAMFER
6
1
0.23 ± 0.05
0.45 BSC
2.25 REF
(DD12) DFN 0106 REV A
BOTTOM VIEW—EXPOSED PAD
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD AND TIE BARS SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibilit y is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
5587f
19
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