M24256-BF View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

M24256-BF

256-Kbit serial I²C bus EEPROM

STMicroelectronics 

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Package information

Table 23. WLCSP (CU)- 8 balls, 1.289x1.1.309 mm, 0.4 mm pitch, with BSC, wafer level

chip scale mechanical data (continued)

Symbol

millimeters

Min

Typ

Max

inches(1)

Min

Typ

Max

G

-

0.245

-

aaa

-

0.110

-

bbb

-

0.110

-

ccc

-

0.110

-

ddd

-

0.060

-

eee

-

0.060

-

-

0.0096

-

-

0.0043

-

-

0.0043

-

-

0.0043

-

-

0.0024

-

-

0.0024

-

1. Values in inches are converted from mm and rounded to the 4rd decimal place.

Figure 22. WLCSP (CU)- 8 balls, 1.289x1.1.309 mm, 0.4 mm pitch, with BSC, wafer

level chip scale recommended footprint









1. Dimensions are expressed in millimeters.

EXPSV[

$=B37IB:/&63B)3B9

DS1766 Rev 34

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