M24256-BF View Datasheet(PDF) - STMicroelectronics

Part Name

Description

MFG CO.

M24256-BF

256-Kbit serial I²C bus EEPROM

STMicroelectronics 

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Revision history

M24256-BW M24256-BR M24256-BF M24256-DR M24256-DF

Date

Table 26. Document revision history (continued)

Revision

Changes

Added:

– Unsawn wafer reference on cover page and Table 25: Ordering

information scheme (unsawn wafer)

– Figure 20: WLCSP (CS) - 8-bump, 1.289 x 1.376 mm, 0.4 mm pitch

wafer level chip scale package recommended footprint

– reference to Engineering samples

Updated:

01-Jun-2015

33

– Section 2.6.2, Section 4.5

– Note 2 on Table 6

– Table 18

– Note 2 on Figure 15

– Table 21

– Note 2 on Table 24

Removed:

– Note on tNS max value on Table 18

Added WLCSP (CU) package in cover page and in Section 9: Package

information, Table 2: Signals vs. bump position.

14-Mar-2018

34

Updated Table 10: AC measurement conditions, Table 22: WLCSP (CS)-

8-bump, 1.289 x 1.376 mm, 0.4 mm pitch wafer level chip scale package

mechanical data, Table 24: Ordering information scheme

46/47

DS1766 Rev 34

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