M24256-BF View Datasheet(PDF) - STMicroelectronics
Part Name
Description
MFG CO.
'M24256-BF' PDF : 47 Pages View PDF
M24256-BW M24256-BR M24256-BF M24256-DR M24256-DF
11
Revision history
Revision history
Date
Table 26. Document revision history
Revision
Changes
Datasheet revision 25 split into:
– M24256-125 datasheet for automotive products (range 3),
– M24256-BW M24256-BR M24256-BF M24256-DR M24256-DF (this
datasheet) for standard products (range 6).
Added:
– Reference M24256-DF
– Table 1: Signal names, Table 12: Memory cell data retention
Updated:
22-Jun-2012
26
– Table 17: 400 kHz AC characteristics and Table 18: 1 MHz AC
characteristics: added set up and hold timing conditiions on WC (tWLDL
and tDHWH)
– Figure 18: M24256-DFCS6TP/K, WLCSP 8-bump wafer-level chip
scale package outline and Table 21: M24256-DFCS6TP/K, WLCSP 8-
bump wafer-level chip scale package mechanical data
– Cycling and data retention limits
Deleted:
– UFDFPN8, package revision MB
01-Aug-2012
27
Updated Figure 3: WLCSP connections and Figure 18: M24256-
DFCS6TP/K, WLCSP 8-bump wafer-level chip scale package outline.
18-Sep-2012
28
Changed title of Figure 3: WLCSP connections.
Updated Section 5.2.2: Current Address Read.
20-Nov-2012 29 Corrected “Device family” data in Table 24: Ordering information scheme.
Deleted note (3) under Table 3: Device select code.
Modified ICCO condition in Table 15: DC characteristics (M24256-BR,
17-Dec-2012
30
M24256-DR device grade 6).
Deleted incorrect table (Table 15. DC characteristics (M24256-R, device
grade 6)).
Updated package list in Table 24: Ordering information scheme.
Updated Figure 3: WLCSP connections.
21-Feb-2014
31
Added notes 4. and 5. in Table 14 and notes 5. and 6. in Table 15 and
Table 16
Updated
17-Jun-2014
32
– Figure 3,
– note 1 on Table 12
– In Table 24 note 1 on Package and blank reference on Option.
DS1766 Rev 34
45/47
46
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