MAC223A8X View Datasheet(PDF) - NXP Semiconductors.
Part Name
Description
MFG CO.
'MAC223A8X' PDF : 13 Pages View PDF
NXP Semiconductors
MAC223A8X
4Q Triac
8. Thermal characteristics
Table 5.
Symbol
Rth(j-h)
Thermal characteristics
Parameter
thermal resistance
from junction to
heatsink
Rth(j-a)
thermal resistance
from junction to
ambient
Conditions
full or half cycle; without heatsink
compound; Fig. 6
full or half cycle; with heatsink
compound; Fig. 6
in free air
10
Zth(j-h)
(K/W)
1
10-1
(1)
(2)
(3)
(4)
Min Typ Max Unit
-
-
3.85 K/W
-
-
5.5 K/W
-
55
-
K/W
aaa-010105
P
10-2
10-3
10-5
10-4
10-3
10-2
10-1
(1) Unidirectional (half cycle) without heatsink compound
(2) Unidirectional (half cycle) with heatsink compound
(3) Bidirectional (full cycle) without heatsink compound
(4) Bidirectional (full cycle) with heatsink compound
tp
t
1
10
tp (s)
Fig. 6. Transient thermal impedance from junction to heatsink as a function of pulse duration
9. Isolation characteristics
Table 6. Isolation characteristics
Symbol
Parameter
Conditions
Visol(RMS)
RMS isolation voltage
from all terminals to external heatsink;
sinusoidal waveform; clean and dust
free; 50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %;
Th = 25 °C
Cisol
isolation capacitance from main terminal 2 to external
heatsink; f = 1 MHz; Th = 25 °C
Min Typ Max Unit
-
-
2500 V
-
10
-
pF
MAC223A8X
Product data sheet
All information provided in this document is subject to legal disclaimers.
1 May 2015
© NXP Semiconductors N.V. 2015. All rights reserved
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