Table 40. Slow internal RC oscillator (128 kHz) electrical characteristics (continued)
Symbol C
Parameter
Conditions1
Value2
Unit
Min Typ Max
SIRCPRE
SIRCTRIM
CC C Slow internal RC oscillator precision
after software trimming of fSIRC
CC C Slow internal RC oscillator trimming
step
TA = 25 °C
—
2 — +2 %
— 2.7 —
SIRCVAR CC C Slow internal RC oscillator variation High frequency configuration 10 — +10 %
in temperature and supply with
respect to fSIRC at TA = 55 °C in high
frequency configuration
1 VDD = 3.3 V ± 10% / 5.0 V ± 10%, TA = 40 to 125 °C, unless otherwise specified.
2 All values need to be confirmed during device validation.
3 This does not include consumption linked to clock tree toggling and peripherals consumption when RC oscillator is
ON.
4.17 ADC electrical characteristics
4.17.1 Introduction
The device provides two Successive Approximation Register (SAR) analog-to-digital converters (10-bit and 12-bit).
NOTE
Due to ADC limitations, the two ADCs cannot sample a shared channel at the same time
i.e., their sampling windows cannot overlap if a shared channel is selected. If this is done,
neither of the ADCs can guarantee their conversion accuracies.
MPC5646C Microcontroller Data Sheet, Rev. 3
72
Preliminary—Subject to Change Without Notice
Freescale Semiconductor