MPC8349VVAGDB View Datasheet(PDF) - Freescale Semiconductor

Part Name

Description

MFG CO.

MPC8349VVAGDB

PowerQUICC II Pro Integrated Host Processor Hardware Specifications

Freescale Semiconductor 

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Package and Pin Listings

18.1 Package Parameters for the MPC8349EA TBGA

The package parameters are provided in the following list. The package type is 35 mm × 35 mm, 672 tape

ball grid array (TBGA).

Package outline

35 mm × 35 mm

Interconnects

672

Pitch

1.00 mm

Module height (typical)

1.46 mm

Solder balls

62 Sn/36 Pb/2 Ag (ZU package)

96.5 Sn/3.5Ag (VV package)

Ball diameter (typical)

0.64 mm

MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 13

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Freescale Semiconductor

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