MPC8349VVALF View Datasheet(PDF) - Freescale Semiconductor

Part Name

Description

MFG CO.

MPC8349VVALF

PowerQUICC™ II Pro Integrated Host Processor Hardware Specifications

Freescale Semiconductor 

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Package and Pin Listings

18.2 Mechanical Dimensions for the MPC8349E TBGA

Figure 38 shows the mechanical dimensions and bottom surface nomenclature for the MPC8349E,

672-TBGA package.

Notes:

1. All dimensions are in millimeters.

2. Dimensions and tolerances per ASME Y14.5M-1994.

3. Maximum solder ball diameter measured parallel to datum A.

4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.

5. Parallelism measurement must exclude any effect of mark on top surface of package.

Figure 38. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC8349E TBGA

MPC8349E PowerQUICC™ II Pro Integrated Host Processor Hardware Specifications, Rev. 10

Freescale Semiconductor

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