MPC8541CPXAJD View Datasheet(PDF) - Freescale Semiconductor

Part Name

Description

MFG CO.

MPC8541CPXAJD

PowerQUICC™ III Integrated Communications Processor Hardware Specifications

Freescale Semiconductor 

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Package and Pin Listings

14.2 Mechanical Dimensions of the FC-PBGA

Figure 41 the mechanical dimensions and bottom surface nomenclature of the MPC8541E 783 FC-PBGA

package.

Notes:

1.

2.

3.

4.

5.

6.

7.

Figure 41. Mechanical Dimensions and Bottom Surface Nomenclature of the FC-PBGA

All dimensions are in millimeters.

Dimensions and tolerances per ASME Y14.5M-1994.

Maximum solder ball diameter measured parallel to datum A.

Datum A, the seating plane, is defined by the spherical crowns of the solder balls.

Capacitors may not be present on all devices.

Caution must be taken not to short capacitors or exposed metal capacitor pads on package top.

The socket lid must always be oriented to A1.

MPC8541E PowerQUICC™ III Integrated Communications Processor Hardware Specification, Rev. 4.2

Freescale Semiconductor

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