MPC8541CPXAJD View Datasheet(PDF) - Freescale Semiconductor

Part Name

Description

MFG CO.

MPC8541CPXAJD

PowerQUICC™ III Integrated Communications Processor Hardware Specifications

Freescale Semiconductor 

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Thermal

The spring mounting should be designed to apply the force only directly above the die. By localizing the

force, rocking of the heat sink is minimized. One suggested mounting method attaches a plastic fence to

the board to provide the structure on which the heat sink spring clips. The plastic fence also provides the

opportunity to minimize the holes in the printed-circuit board and to locate them at the corners of the

package. Figure 47 and provide exploded views of the plastic fence, heat sink, and spring clip.

Figure 47. Exploded Views (1) of a Heat Sink Attachment using a Plastic Fence

MPC8541E PowerQUICC™ III Integrated Communications Processor Hardware Specification, Rev. 4.2

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Freescale Semiconductor

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