MT28C3212P2FL-10B View Datasheet(PDF) - Micron Technology
Part Name
Description
MFG CO.
'MT28C3212P2FL-10B' PDF : 47 Pages View PDF
1.05 ±0.075
2 MEG x 16 PAGE FLASH
128K x 16 SRAM COMBO MEMORY
66-BALL FBGA
SEATING PLANE
0.10 C
C
66X Ø 0.35
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS Ø 0.33
2.80 ±0.05
5.60
8.80
0.80
(TYP)
BALL A12
CL
4.40 ±0.05
6.00 ±0.05
12.00 ±0.10
BALL A1
BALL #1 ID
0.80
(TYP)
CL
8.00 ±0.10
4.00 ±0.05
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb or
62% Sn, 36% Pb, 2%Ag
SOLDER BALL PAD: Ø .27mm
SUBSTRATE: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
BALL A1
1.40 MAX
NOTE: 1. All dimensions in millimeters MAX or typical where noted.
MIN
2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.27mm per side.
DATA SHEET DESIGNATION
This data sheet contains minimum and maximum limits specified over the complete power supply and
temperature range for production devices. Although considered final, these specifications are subject to change,
as further product development and data characterization sometimes occur.
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
E-mail: prodmktg@micron.com, Internet: http://www.micron.com, Customer Comment Line: 800-932-4992
Micron is a registered trademark and the Micron logo and M logo are trademarks of Micron Technology, Inc.
2 Meg x 16 Page Flash 128K x 16 SRAM Combo Memory
MT28C3212P2FL_2.p65 – Rev. 2, Pub. 4/02
46
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2002, Micron Technology, Inc.
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