MT48LC64M4A2FG-75L View Datasheet(PDF) - Micron Technology
Part Name
Description
MFG CO.
'MT48LC64M4A2FG-75L' PDF : 86 Pages View PDF
Package Dimensions
Figure 7: 54-Pin Plastic TSOP "TG/P" (400 mil)
Pin #1 ID
2X 2.28
256Mb: x4, x8, x16 SDRAM
Package Dimensions
0.10
1.2 MAX
0.375 ±0.075 TYP
2X R 0.75
22.22 ±0.08 2X R 1.00
Package may
or may not be
assembled with
a location notch.
22.42
0.71
0.15
+0.03
-0.02
10.16 ±0.08
11.76 ±0.20
Package may or may not be
assembled with a location notch.
0.80 TYP
(for reference
only)
Plated lead finish: 90% Sn, 10% Pb or 100%Sn
Plastic package material: epoxy novolac
Package width and length do not
include mold protrusion. Allowable
protrusion is 0.25 per side.
Gage plane
0.25
0.10
+0.10
-0.05
See detail A
0.50 ±0.10
0.80
Detail A
Notes:
1. All dimensions are in millimeters.
2. Package width and length do not include mold protrusion; allowable mold protrusion is
0.25mm per side.
3. 2X means the notch is present in two locations (both ends of the device).
4. Package may or may not be assembled with a location notch.
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. S 12/12 EN
15
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 1999 Micron Technology, Inc. All rights reserved.
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