MT48LC64M4A2FG-75L View Datasheet(PDF) - Micron Technology
Part Name
Description
MFG CO.
'MT48LC64M4A2FG-75L' PDF : 86 Pages View PDF
256Mb: x4, x8, x16 SDRAM
Temperature and Thermal Impedance
Table 6: Thermal Impedance Simulated Values
Die
Revision
D
G
Package
54-pin TSOP
(TG, P)
54-ball VFBGA
(B4, F4)
60-ball FBGA
(BB, FB)
54-pin TSOP
(TG, P)
54-ball VFBGA
(B4, F4)
60-ball FBGA
(BB, FB)
Substrate
Low Con-
ductivity
High Con-
ductivity
Low Con-
ductivity
High Con-
ductivity
Low Con-
ductivity
High Con-
ductivity
Low Con-
ductivity
High Con-
ductivity
Low Con-
ductivity
High Con-
ductivity
Low Con-
ductivity
High Con-
ductivity
Θ JA (°C/W)
Airflow =
0m/s
81
44
64.9
51.5
67
40.9
122.3
101.9
96.9
74.0
68.8
47.9
Θ JA (°C/W)
Airflow =
1m/s
63.8
47.3
50.8
41.6
51.2
35.1
105.6
93.5
81.9
66.3
55.9
42.0
Θ JA (°C/W)
Airflow =
2m/s
57.6
Θ JB (°C/W) Θ JC (°C/W)
45.3
10.3
44.5
39.1
44.8
31.4
3.2
38.1
31.4
47.8
19.7
6.7
32.2
18.6
98.1
89.5
20.7
88.8
87.6
81.9
69.5
11.5
62.7
60.7
51.1
42.1
10.9
39.9
34.9
Notes:
1. For designs expected to last beyond the die revision listed, contact Micron Applications
Engineering to confirm thermal impedance values.
2. Thermal resistance data is sampled from multiple lots, and the values should be viewed
as typical.
3. These are estimates; actual results may vary.
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. S 12/12 EN
20
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